Deep reactive ion etching
Tegal 110 S/DE in Uppsala
The Tegal 110 S/DE is documented for deep silicon etching using Bosch-type processes, with silicon-oxide etching also described. Etch results depend on the pattern and material stack. A useful inquiry should state the target geometry and mask system rather than assume a recipe will transfer directly between projects.
- Manufacturer
- Tegal
- Model
- 110 S/DE
- Technique
- Deep reactive ion etching
- Location
- Uppsala, Sweden
Questions to clarify for your project
- What etch depth, openings and geometry are required?
- What substrate and mask stack will the facility need to assess?
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