Wafer dicing
DISCO DAD3221 in Uppsala
The DISCO DAD3221 is an automatic dicing saw for cutting wafers and substrates. Its public description includes alignment and inspection functions, with material suitability dependent on blade selection. For a useful assessment, describe the material stack and desired pieces, and confirm how the workpiece will be mounted and inspected.
- Manufacturer
- DISCO
- Model
- DAD3221
- Technique
- Wafer dicing
- Location
- Uppsala, Sweden
Questions to clarify for your project
- What substrate and coating stack needs to be cut?
- What cut layout and edge-quality requirements matter?
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